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The research involved preparing a deep eutectic solvent containing a 4: 1 stoichiometric mixture of ethylene glycol and lithium chloride to investigate zinc electrodeposition. Electrochemical methods such as cyclic voltammetry measurement have been used to understand the electrochemical properties of zinc electrolytes in the absence and presence of additives. Likewise, the deep eutectic solvent's physical properties (density and conductivity) were studied in the absence and presence of additives. Also, the effect of the deep eutectic solvent in the electroplating process on a copper substrate was studied in the absence and presence of additives. The resulting roughness, thickness, and surface morphology of the deposited zinc were distinguished using atomic force microscopy, scanning electron microscopy, and X-ray diffraction, indicating that additives, act as a highly effective brightener allowing the formation of homogeneous and flat zinc deposits.